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HS CODES SECTION
Section Codes Section Description
Section-01 Chapter (84-85) – Section XVI - Machinery and mechanical appliances; electrical equipment; parts thereof; sound recorders and reproducers, television image and sound recorders and reproducers, and parts and accessories of such articles
Hs Codes Chapter
Chapter Chapter Description
Chapter-84 Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof
HS CODES
Hs Codes Heading Description Import Data Export Data
84561110 Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : For working stone, ceramics, and like mineral materials Import Data Export Data
84561120 Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : For drilling plastics, Of a kind used in the production of semiconductor wafers Import Data Export Data
84561130 Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : For drilling plastics, Of a kind used solely or principally for the manufacture of printed circuits, printed circuit assemblies, parts of heading 85.17, or parts of automatic data processing machines Import Data Export Data
84561140 Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : For drilling plastics, Other Import Data Export Data
84561150 Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : Other, Of a kind used in the production of semiconductor wafers Import Data Export Data
84561160 Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : Other, Of a kind used solely or principally for the manufacture of printed circuits, printed circuit assemblies, parts of heading 85.17, or parts of automatic data processing machines Import Data Export Data
84561170 Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : Other, Laser cutters for cutting contacting tracks in semiconductor production by laser beam Import Data Export Data
84561190 Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : Other, Other Import Data Export Data

Frequently Asked Questions (FAQs)

What is the item description for 845611 of HScode New-Zealand?

The description of the item 845611 of New-Zealand HScode: Machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electrodischarge, electrochemical, electron beam, ionicbeam or plasma arc processes; waterjet cutting machines : Operated by laser or other light or photon beam processes : Operated by laser

What is the chapter code for 845611 of New-Zealand HScode?

The chapter code for 845611 of New-Zealand HScode: Chapter (84-85) – Section XVI - Machinery and mechanical appliances; electrical equipment; parts thereof; sound recorders and reproducers, television image and sound recorders and reproducers, and parts and accessories of such articles

What are the other detailed codes for 845611 of New-Zealand HScode?

Detailed code for 845611 of New-Zealand HScode:
  • 84561110: Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : For working stone, ceramics, and like mineral materials
  • 84561120: Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : For drilling plastics, Of a kind used in the production of semiconductor wafers
  • 84561130: Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : For drilling plastics, Of a kind used solely or principally for the manufacture of printed circuits, printed circuit assemblies, parts of heading 85.17, or parts of automatic data processing machines
  • 84561140: Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : For drilling plastics, Other
  • 84561150: Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : Other, Of a kind used in the production of semiconductor wafers
  • 84561160: Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : Other, Of a kind used solely or principally for the manufacture of printed circuits, printed circuit assemblies, parts of heading 85.17, or parts of automatic data processing machines
  • 84561170: Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : Other, Laser cutters for cutting contacting tracks in semiconductor production by laser beam
  • 84561190: Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) : Other, Other
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